JTX650 Fully Automatic Gold Removal and Tin Plating Machine

CECJC's JTX650 Fully Automatic Gold Removal and Timing Machine

The JTX650 Fully Automatic Gold Removal and Timing Machine is suitable for QFP/SOP/QFN/DIP packages, resistors, capacitors, and some irregularly shaped components. It addresses issues such as gold embrittlement and oxidation on the chip soldering surface, controls gold content, improves solderability, and also resolves problems like solder bridging and pin oxidation in manual timing. Each chip processed by the JTX650 undergoes quality inspection via a high-definition camera, screening out defects such as solder bridging on chip pins and solder slag adhesion, achieving closed-loop quality control. The equipment automatically records data, enabling full data traceability management throughout the timing process.

Process Flow:

Pin flux application----Pin preheating----Gold removal and timing in the tin pot-----Pin flux application-----Pin preheating-----Timing in the tin plating pot-----Hot air drying of pins

Performance Features:

1. Utilizes X/Y/Z/U/W five-axis linkage combined with vision technology for precise control

2. Adjustable nozzle suction force for different components

3. Safety grippers easily handle irregularly shaped devices and connectors, automatically locating the device center and contour

4. Process control: Timing temperature, timing depth, movement speed, dwell time, timing angle

5. Closed-loop quality control

6. Tin pot low-tin alarm device

7. Solder feed low-tin alarm

8. Automatic soldering smoke purification function